Thermo-mechanicalreliabilityanalysisofaRFSiPmodulebasedonLTCCsubstrate,MicroelectronicsReliability,79,38-47,2017_bf88必发官网 Thermo-mechanicalreliabilityanalysisofaRFSiPmodulebasedonLTCCsubstrate,MicroelectronicsReliability,79,38-47,2017_bf88必发官网

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Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate, Microelectronics Reliability, 79, 38-47, 2017

2019/09/27
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